Xiaomi has confirmed its next flagship smartphone offering is going to be referred to as the Redmi K50 Extreme Edition. The Chinese company also stated the phone will be sporting the Snapdragon 8+ Gen 1 chipset and will be ready to hit streets this month itself. This also marks the first time the company has confirmed the phone’s naming given that a few other names such as the Redmi K50 Ultra or Redmi K50S Pro were doing the rounds of the internet so far. The company too to its Weibo handle to confirm the name of the upcoming flagship as the Redmi K50 Extreme Edition.
The upcoming phone is also going to be the epitome of the Redmi brand, one that sets new standards for style and performance. The company also stated the phone comes with deep roted upgrades that sort of reinvents the phone inside out. The phone will initially be rolled out in China this month before it makes it to other parts of the world. Xiaomi however is yet to confirms when exactly the phone will see a launch in China, saying instead that it is going to happen sometime this month.
Other details known of the Redmi K50 Extreme Edition is that it will come powered by the Snapdragon 8+ Gen 1 chipset though there is also going to be a separate model that would be sporting the Dimensity 9000+ processor. The phone will have memory options of 8 GB and 12 GB while storage options range from 128 GB and 256 GB. Its not known how big the battery on the phone is going to be though rumor has it that it will support 120W super fast charging which should top up the battery from zero well within an hour, maybe even within 20 mins itself.
Further details that are being associated with the Redmi K50 Extreme Edition model is a 6.67-inch OLED panel having 120Hz refresh rate. The display is also reported to come with 1920Hz PWM high-frequency dimming for enhanced performance. A leakster meanwhile is claiming the upcoming Redmi flagship phone scored a quite impressive 1,120,691 on Geekbench. Apart from these, the phone is also reported to come with advanced heat radiation casing that will ensure quick dissipation of heat. This should guarantee optimum levels of performance over a longer period of time.
Keep watching for more on this as it emerges.
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